王文昌 教授级高级工程师
Email:king717@cczu.edu.cn;king717@139.com
教育经历:
2008/09 – 2012/04,南京理工大学,应用化学,硕士
2001/09 – 2005/06,江苏工业学院,应用化学,学士
工作经历:
2005/06-至今,新葡萄88805官网
研究方向:
表面处理、功能材料;
分析化学;
个人荣誉:
2014年获中国石油和化学工业联合会“科技进步三等奖”1项;
2020年获中国表面工程协会“科技进步一等奖”1项;
2023年获中国有色金属工业协会“科技进步二等奖”1项;
2023年获中国轻工业联合会“科技进步三等奖”1项;
社会兼职:
江苏省表面工程行业协会,技订咨询、项目评审专家库专家;
常州市表面工程协会专家委员会专家;
教学科研项目:
(中-日)高性能超薄锂电铜箔联合实验室,常州市国际合作;
化学镀软镍在柔性线路板中的应用技术研究,江苏省重点实验室;
插层型偶氮二甲酰胺-凹凸棒土纳米发泡剂的研制,常州市科技支撑;
多穗石柯叶的提取、产品开发以及有效成分的化学结构修饰研究,横向研发;
新能源汽车用高性能环保电泳涂料的研发及产业化,横向研发;
斜流压气叶片式扩压器材料的组织结构与力学性能研究,横向研发;
发表论文
A novel electrochemical sensor based on gold nanobipyramids and poly-l-cysteine for the sensitive determination of trilobatin[J]. Analyst, 2023, 148(10): 2335-2342(SCI收录);
Effect of deposition potential on electrodeposition of Sn-Ag-Cu ternary alloy solderable coating in deep eutectic solvent[J]. Journal of Electroanalytical Chemistry, 2023: 117613(SCI收录);
A mini-review on the applications of conductive polymers in electrochemiluminescent sensors[J]. Microchemical Journal, 2023: 109451(SCI收录);
Selective determination of cuprous ion in copper dissolving solution based on bathocuproine-modified expanded graphite electrode[J]. Analytical Sciences, 2023: 1-9(SCI收录);
Study on Electroless Plating Ni-W-P Ternary Alloy with High Tungsten from Compound Complexant Bath,JMEP,2020,Vol.29(12):8213-8220(SCI收录);
The Effects of Potassium Iodate as an Environment-Friendly Stabilizer on Preparation and Properties of Electroless Ni-B Plating,JMEP, 2022,Vol.31(1): 495-502(SCI收录);
Microstructures And High-Temperature Tribological Behaviors Of Magnetron Sputtered DLC Coatings,Surface Review and Letters,2018,Vol.25(8):1850098:1-13(SCI收录);
Structural characteristics and high-temperature tribological behaviors of laser cladded NiCoCrAlY−B4C composite coatings on Ti6Al4V alloy,Trans. Nonferrous Met. Soc. China,2021,Vol.31(9):2729-2739(SCI收录);
Effects of Cladding Speed on the Tribo-Corrosive and Electrochemical Performance of a Laser Clad FeCoCr-50% Al Coating on S355 Structural Steel,Lasers in Engineering, 2021,Vol.51:261-277(SCI收录);
High-temperature tribological behaviours of H13 hot work mould steel by low-temperature plasma nitriding process[J]Canadian Metallurgical Quarterly, 2022: 1-13(SCI收录);
Effect of Ti mass fraction on microstructure, salt spray corrosion and electrochemical performances of laser cladded Fe90–6%Al2O3 coatings,Materials Today Communications 35 (2023) 106077(SCI收录);
Ductile electroless Ni-P coating onto flexible printed circuit board, Applied Surface Science, 2016, 367: 528-532(SCI收录);
Microstructures And High-Temperature Tribological Behaviors Of Magnetron Sputtered Dlc Coatings[J]. Surface Review and Letters, 2018, 25(05): 1850098(SCI收录);
AFM analysis of TiN, TiAlN and TiAlSiN coatings prepared by cathodic arc ion plating, Journal of Wuhan University of Technology Technology-Materials Science Edition, 2016, 31 (5): 1093-1098(SCI收录);
Electrochemical determination of brilliant blue and tartrazine based on an ionic liquid-modified expanded graphite paste electrode, Journal of AOAC International 2015, 98 (3): 817-821(SCI收录);
A sensitive and selective pyrosine sensor based on palygorskite–graphene modified electrode, Applied Clay Science, 2013, 80: 52-55(SCI收录);
热处理时间对Ni-P镀层组织形貌和磨损的影响,建筑材料学报,2013,16(6):984-990(EI收录);
提高SiC砂在PEG为基础的线切割液中分散稳定性的研究,太阳能学报,2014,35(8):1400-1404(EI收录);
YL113铝合金阳极氧化膜表面-界面形貌与能谱分析,材料热处理学报,2014,35(3):177-183(EI收录);
粘度与表面张力对硅片切割液稳定性能影响的研究,太阳能学报,2015,36(2):387-391(EI收录);
等离子喷涂WC-12Co涂层表面-界面性能,材料热处理学报,2015,36(12):190-196(EI收录);
授权专利
一种在低共熔溶剂中化学镀镍或镍合金镀层的方法,授权公告日:2023.03.21,中国专利ZL202110568747.7;
磷化反应型金刚线拉拔油及制备方法和应用,授权公告日:2023.10.20,中国专利:ZL202211309250.4;
一种在低共熔离子液体中电沉积制备超疏水Zn-Fe合金镀层的方法,中国专利:ZL202110475815.5;
一种低温化学镀Ni-B二元合金层的化学镀液及化学镀方法,中国专利ZL202010036880.3;
流动注射法检测电解铜箔的电沉积液中氯离子含量的方法,中国专利:201910486973.3;
电解铜箔的铜电解液中氯离子的测量方法,授权发明专利,ZL201910486982.2;
一种固定三联吡啶钌及电化学发光检测诱惑红的方法,授权发明专利,ZL201611027826.2;
一种用于制备金刚石线锯的二氧化钛溶胶及其应用,授权发明专利,ZL201610392827.0;
一种电解铜箔用钛基铱-钽氧化物涂层阳极的再生处理液及再生方法,授权发明专利,ZL201810984004.6;
一种阴极辊化学抛光液及抛光方法,授权发明专利,ZL201810940388.1;
溶胶—凝胶法制备金刚石线锯,中国,ZL201610273160.2;
印制线路板蚀刻工艺的自动化控制方法,中国,ZL201110089190.5;
化学镀镍液中稳定剂的电化学测定方法,中国,ZL201210322852.3);
一种用于助焊剂中消除焊点光泽的消光剂,中国,ZL201010166180.2;
印制线路板直接孔金属化的前处理溶液及方,中国,ZL200610097978.X;
一种N-甲基苯胺生产废水循环利用,中国,ZL201310511973.7;
单晶硅太阳能电池表面处理用制绒剂及使用方法,中国,ZL201110177294.1;
一种能够消除锡珠的用于波峰焊用助焊剂的添加剂,中国,ZL201010166190.6;
粘结钕铁硼磁体电镀镍方法,授权公告日2010.12.29,中国,ZL2000810025451.5;
印制板表面附着钯了除去溶液和除去方法,中国,ZL200610097973.7;
一种化学镀Ni-P镀层的晶化处理方法,中国,ZL201210380852.9;